HOME    NICKEL & NICKEL ALLOY    expansion alloy 4J29
expansion alloy 4J29, also known as Kovar alloy, has a low expansion coefficient and excellent thermal stability, and is widely used in the packaging of electronic components and glass-metal packaging structures. The 4J29 alloy matches the thermal expansion coefficient of the glass in a specific temperature range, which can effectively prevent the seal failure caused by the difference in thermal expansion. This alloy is primarily used in the manufacture of transistor housings, integrated circuit

expansion alloy 4J29

产品详情

Domestic and foreign approximate grades (Chinese)

  • United States: Kovar (UNS K94610)
  • Germany: 1.3981
  • Japan: Pernifer 2918
  • France: NILO K
  • international standards: ASTM F15

chemical composition
4 J29 alloy is as follows:
-Nickel (Ni):29%
-Cobalt (Co):17%
-Iron (Fe): balance
-Other elements: trace elements such as carbon (C), manganese (Mn), silicon (Si)

physical properties
-Density: 8.2 g/cm & sup3;
-Melting point: 1450°C
-Coefficient of thermal expansion: approximately 5.5 x 10 "/°C in the temperature range of 20 - 400°C

mechanical properties
-Tensile strength: about 450 MPa
-Yield strength: about 310 MPa
-Ductility: Good, suitable for drawing and forming processing
-Hardness: HV 150 - 200

Application areas
-electronic packaging: packaging materials for transistors, diodes, integrated circuits.
-Optics: Suitable for use in optical and electronic devices, providing sealing and thermal stability.
-Vacuum Devices: Used in vacuum tubes and laser devices, it can provide hermetic packaging.

Supply Specifications
-shape: bar, plate, strip, pipe, etc.
-size: customized according to customer needs

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